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4层板层叠结构

PCB板厚:

0.6mm 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm

内层铜厚:

1oz 0.5oz
PCB板厚:0.6mm
外层铜厚:1oz      内层铜厚:1oz
L1


铜厚:H0.0175mm


PP胶:76280.2mm
L2/L3

1.5mm 1/1 含铜

芯板:含铜1/10.5mm


PP胶:76280.2mm
L4


铜厚:H0.0175mm
成品厚度:0.6MM/±0.2mm

推荐阻抗线宽

阻抗层参考层OHM线宽mil线距mil
TOP/BOTTOMTOP参考L2
BOTTOM参考L2
5013mil/
9010mil6mil
7.5mil4mil
1008mil6.5mil
5.5mil4mil
L2/L3L2 参考 L1&L3
L3 参考 L4&L2
509.5mil/
906.2mil6.8mil
4.4mil4.6mil
1005.4mil8.6mil
3.4mil5.1mil

阻抗计算参数

A.PP介电常数(PP型号:7628/1080/2313/2116,介电常数:4.2)

B.板材介电常数:4.2

C.阻焊厚度参数(基材上阻焊:0.8mil,铜箔面上阻焊:0.6mil,阻焊介电常数:3.5)

6层板层叠结构

PCB板厚:

1.0mm 1.2mm 1.6mm 2.0mm

内层铜厚:

1oz
PCB板厚:1.2mm
外层铜厚:1oz      内层铜厚:1oz
L1


铜厚:H0.0175mm


PP胶:21160.125mm
L2/L3

0.7mm 1/1 含铜

芯板:含铜1/10.7mm


PP胶:2116*20.25mm
L4/L5

0.7mm 1/1 含铜

芯板:含铜1/10.7mm


PP胶:21160.125mm
L6


铜厚:H0.0175mm
成品厚度:1.2MM/±10%mm

推荐阻抗线宽

阻抗层参考层OHM线宽mil线距mil
TOP/BOTTOMTOP参考L2
BOTTOM参考L5
507.5mil/
905.6mil4.4mil
7.5mil8.5mil
1004mil4mil
4.8mil5.2mil
L3/L4L3 参考 L2&L5
L4 参考 L2&L5
5025mil/
908.1mil5.9mil
6.2mil4.8mil
1007.2mil7.3mil
3.8mil4.7mil

阻抗计算参数

A.PP介电常数(PP型号:7628/1080/2313/2116,介电常数:4.2)

B.板材介电常数:4.2

C.阻焊厚度参数(基材上阻焊:0.8mil,铜箔面上阻焊:0.6mil,阻焊介电常数:3.5)

8层板层叠结构

PCB板厚:

1.2mm 1.6mm 2.0mm

内层铜厚:

1oz

PCB板厚:1.2mm
外层铜厚:1oz      内层铜厚:1oz
L1


铜厚:H0.0175mm


PP胶:21160.125mm
L2/L3

0.4mm 1/1 含铜

芯板:含铜0.4mm


PP胶:2116*20.25mm
L4/L5

0.4mm 1/1 含铜

芯板:含铜0.4mm


PP胶:2116*20.25mm
L6/L7

0.4mm 1/1 含铜

芯板:含铜0.4mm


PP胶:21160.125mm
L8


铜厚:H0.0175mm
成品厚度:1.2MM/±0.10mm

推荐阻抗线宽

阻抗层参考层OHM线宽mil线距mil
TOP/BOTTOMTOP参考L2
BOTTOM参考L7
507.55mil/
905.7mil4.3mil
7.5mil8.5mil
1004mil4mil
4.8mil5.2mil
L3/L6L3 参考 L2&L4
L6 参考 L5&L7
508.5mil/
904.7mil4.8mil
5.9mil6.1mil
1003.2mil4.8mil
4.1mil5.9mil

阻抗计算参数

A.PP介电常数(PP型号:7628/1080/2313/2116,介电常数:4.2)

B.板材介电常数:4.2

C.阻焊厚度参数(基材上阻焊:0.8mil,铜箔面上阻焊:0.6mil,阻焊介电常数:3.5)

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